FU, X.; SUN, X. Analysis of packaging recycling patterns using mathematical modeling. Revista Internacional de Contaminación Ambiental, [S. l.], v. 38, p. 109–116, 2023. DOI: 10.20937/RICA.54588. Disponível em: https://www.revistascca.unam.mx/rica/index.php/rica/article/view/54588. Acesso em: 27 abr. 2024.